Integrated circuit package

Details Integrated circuit package Integrated circuit package

2007-09-04

2007-09-04

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S666000, C257S673000, C257S677000, C438S011000

Reexamination Certificate

active

11088110

ABSTRACT:
An IC package includes a package body of non-conductive material. A conductive heat-sink pad includes an interior pad portion located within an interior of the package body. An exterior pad portion is located external to the package body. The exterior pad portion includes at least two pad pieces that are spaced apart to define at least one channel that separates the at least two pad pieces, the at least two pad pieces being electrically connected with each other. The at least two pad pieces may be flush with an underside surface of the package body or one or more of the pad pieces may extend outwardly from the package body.

REFERENCES:
patent: 4292647 (1981-09-01), Lee
patent: 4937435 (1990-06-01), Goss et al.
patent: 4953060 (1990-08-01), Lauffer et al.
patent: 5073817 (1991-12-01), Ueda
patent: 5325265 (1994-06-01), Turlik et al.
patent: 5959356 (1999-09-01), Oh
patent: 6025640 (2000-02-01), Yagi et al.
patent: 6392301 (2002-05-01), Waizman et al.
patent: 6731011 (2004-05-01), Verma et al.
patent: 6762067 (2004-07-01), Quinones et al.
patent: 6774466 (2004-08-01), Kajiwara et al.

Affiliated with

Also associated with

Rating

Integrated circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3779271