Integrated circuit package

Details Integrated circuit package Integrated circuit package

1981-02-13

1982-07-27

Kucia, Richard R.

Electricity: electrical systems and devices

Miscellaneous

361395, 361403, 361414, H05K 114

Patent

active

043420699

ABSTRACT:
An integrated semiconductor package containing circuitry capable of supporting separately packaged semiconductors to achieve greater circuit board density and to allow separate semiconductor packages which cooperate with the supporting semiconductor package and die to be interchanged. The supporting die is interconnected electrically to lead pins and socket contacts using conductive circuitry compatible with the other semiconductor die.
In a first embodiment corresponding metallization patterns are used to electrically interconnect an integrated circuit package to a conventional printed wiring board or ceramic wiring board containing socket contacts to receive lead pins from another integrated circuit package. A second embodiment is a unitized package containing integral socket contacts within the unitized integrated package to receive lead pins from another integrated circuit package.

REFERENCES:
patent: 2725537 (1956-06-01), Wolfe
patent: 2907926 (1959-10-01), Slack
patent: 3447040 (1969-05-01), Denton
patent: 3634600 (1972-01-01), Griffin
patent: 3760090 (1973-09-01), Fowler
patent: 3778754 (1973-12-01), Takashashi
patent: 3874768 (1975-04-01), Cutchaw
patent: 3904262 (1975-09-01), Cutchaw
patent: 3941916 (1976-03-01), Morse
patent: 3958155 (1976-05-01), Bogholtz
patent: 4004196 (1977-01-01), Doucet
patent: 4012117 (1977-03-01), Lazzery
Rasile et al., Low-Cost Stacked Module, IBM Tech. Disc. Bull., v. 22, #2, Jul. 1979, pp. 525 & 526.

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