Integrated circuit package

Details Integrated circuit package Integrated circuit package

1992-04-15

1994-03-08

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 174262, 174265, 174267, 361785, H05K 0100

Patent

active

052935027

ABSTRACT:
The present integrated circuit package provides both a high density of conductor poles, and reduced crosstalk noises between the conductor poles. The conductor poles are received within holes in an insulating substrate. The insulating substrate has a laminated, multi-layer ceramic substrate structure comprising insulating plates having metallized layers thereon which constitute a portion of the walls of the holes. In addition, insulating layers for insulating the metallized layers from the conductor poles are formed within a selected number of the holes.

REFERENCES:
patent: 4791722 (1988-12-01), Miller, Jr.
patent: 5073684 (1991-12-01), Miyabayashi
N. Goldberg, "Design of Thin Film Multichip Modules," The International Journal For Hybrid Microelectronics, vol. 4, Oct. 1981, pp. 289-293.
Y. Noguchi et al, "Analysis of Characteristics of the Shielded-Coplanar Waveguide by Conformal Mapping Method," Journal of Electro Communication Society, vol. J60-B, No. 8, 1977, pp. 561-566.
T. Sekiguchi et al, "A Multi-Chip Packaged GaAs 16 x 16 Bit Parallel Multiplier," Optoelectronics Laboratories, pp. 1-4.

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