Integrated circuit package

Details Integrated circuit package Integrated circuit package

1984-10-09

1986-09-16

Rosenbaum, Mack

Metal working

Method of mechanical manufacture

Electrical device making

174 52FP, 357 70, H05K 330, H05K 118

Patent

active

046113983

ABSTRACT:
An integrated circuit package cover includes a groove with a quadrangular cross-section which contains a self-supporting sealant material of similar cross-section. During assembly, the sealant material is penetrated by the lead-ins and flows around them to achieve an environmental seal for the packaged chip.

REFERENCES:
patent: 3265806 (1966-08-01), Burks et al.
patent: 3651434 (1972-03-01), McGrough et al.
patent: 3684818 (1972-08-01), Netherwood
patent: 3714370 (1973-01-01), Nixen et al.
patent: 3981074 (1976-09-01), Yamamoto et al.
patent: 4139859 (1979-02-01), Lewis et al.
patent: 4285002 (1981-08-01), Campbell
patent: 4499333 (1985-02-01), Chee et al.

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