Integrated circuit package

Details Integrated circuit package Integrated circuit package

1980-12-29

1982-12-07

Kucia, R. R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 52PE, 174117A, 361403, 361408, 361418, H05K 118

Patent

active

043630766

ABSTRACT:
An Integrated Circuit Package in which integrated circuit (I.C.) chips having flexible beam leads, the inner lead bond sites of which are bonded to input/output (I/O) terminals on the active faces of the chips, are mounted active face down on a surface of a substrate. The surface of the substrate is provided with chip sites and outer lead (OL) pads associated with each chip site. A preform of a fiber glass web coated with a thermosetting plastic is positioned on each chip site between a chip site and the active face of the I.C. chip. The plastic material of the preforms encapsulates the active faces of the chips, including a portion of each of the leads proximate a chip, and secures each chip to its chip site. The outer lead bond sites of the leads are bonded to OL pads of the substrate with the exposed portions of the leads between the OL pads and the encapsulated portion being bent away from the substrate and under compression.

REFERENCES:
patent: 3325582 (1967-06-01), Ehrmann
patent: 3704515 (1972-12-01), Nelson
patent: 3726007 (1973-04-01), Keller
patent: 3982979 (1976-09-01), Hentz
patent: 4195195 (1980-03-01), Miranda

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