Integrated circuit package

Details Integrated circuit package Integrated circuit package

1992-06-08

1998-02-24

Whitehead, Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257774, 257687, 257798, H01L 23053, H01L 2312

Patent

active

057214530

ABSTRACT:
An integrated circuit package comprises a power supply conductor film having a potential and conductor columns insulated from and passed through the power supply conductor film. A power supply conductor column comprises one of the conductor columns connected to a power supply having a potential different from the power supply conductor film. The other conductor columns are signal conductor columns for exchanging signals with mounted integrated circuits. An insulation space between the power supply conductor film and the power supply conductor column is greater than an insulation space between the power supply conductor film and a signal conductor column. Thereby, a probability of short-circuit occurrence in the power supply conductor film across the power supply conductor column is lowered.

REFERENCES:
patent: 4667219 (1987-05-01), Lee et al.

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