Integrated circuit package

Details Integrated circuit package Integrated circuit package

1996-07-25

1998-07-21

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Transmission line lead

257698, 257700, H01L 2940

Patent

active

057838577

ABSTRACT:
An IC package appropriate for microwave devices, integrated circuits, multichip modules, and hybrid circuit assemblies and power devices comprises an outer interconnect (2) and an inner interconnect (3). Lead lines (8) on an outer interconnect (2) are in electric engagement with respective access lines (13) on an inner interconnect (3). Contacts (21) of an IC are electrically interconnected with the access lines (13) on the inner interconnect (3). A package according to the teachings of the present invention provides for efficient heat dissipation from the package interior and an efficient electrical transition from the interior of a package.

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A New Leadframeless IC Carrier Package Using Metal Base Substrate; 6 pages.
Metal Quad Package (MQP) ; 15 Pages.
Life Over 30 GHZ; 3 Pages.

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