Integrated circuit package

Details Integrated circuit package Integrated circuit package

1982-08-23

1984-03-20

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 174 52FP, 174 52PE, H05K 334

Patent

active

044372353

ABSTRACT:
An integrated circuit package in which integrated circuit (I.C.) chips having flexible beam leads, the inner lead bond sites of which are bonded to input/output (I/O) terminals on the active faces of the chips, are mounted active face down on a surface of a substrate. The surface of the substrate is provided with chip sites and outer lead (OL) pads associated with each chip site. A preform of a fiber glass web coated with a thermosetting plastic is positioned on each chip site between a chip site and the active face of the I.C. chip. The plastic material of the preforms encapsulates the active faces of the chips, including a portion of each of the leads proximate a chip, and secures each chip to its chip site. The outer lead bond sites of the leads are bonded to OL pads of the substrate with the exposed portions of the leads between the OL pads and the encapsulated portion being bent away from the substrate and under compression.

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patent: 4143456 (1979-03-01), Inove
patent: 4159221 (1979-06-01), Schuessler
patent: 4180608 (1979-12-01), Del
patent: 4312116 (1982-01-01), Moser et al.

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