1988-01-19
1989-11-07
LaRoche, Eugene R.
357 71, 357 74, 357 80, H01L 2348, H01L 2944, H01L 2960, H01L 3902
Patent
active
048795887
ABSTRACT:
An improved integrated circuit package of the MLCP type suitable for use both at high operating frequencies and with chips dissipating large amounts of power. Electric power supplying wirings and signal transmitting wirings are disposed on entirely separate surfaces, the power transmitting wirings being formed on entire peripheries of respective, dedicated ceramic plates. Termination resistors for the signal wirings though are formed on the same ceramic plates which contain the power supplying wirings.
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Goto Tomoji
Ida Masao
Ohtsuka Akira
LaRoche Eugene R.
Nippon Telegraph and Telephone Corporation
Shingleton Michael B.
Sumitomo Electric Industries Ltd.
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