Integrated circuit package

Details Integrated circuit package Integrated circuit package

1979-01-16

1981-08-18

Larson, Lowell A.

29827, 357 80, 357 81, H01L 2310, H01R 4302

Patent

active

042850029

ABSTRACT:
A large scale integrated circuit package including a base or substrate section and a lid structure of thermally conductive material to which the chip or die of the package is mounted. A frame defining a recess for the chip is provided on the lid and the frame carries conductive tracks which are coupled to the connector pads of the chip or die. The base has a recess which accommodate the chip and frame and which is closed by the lid structure. The base of the recess is provided with conductive tracks which co-operate with those on the frame. The electrical connections between the two sets of tracks is formed by thermo-compression techniques.

REFERENCES:
patent: 3872583 (1975-03-01), Beall et al.
patent: 3908185 (1975-09-01), Martin
patent: 4142203 (1979-02-01), Dietz
IBM Tech. Discl. Bull., vol. 15, No. 1, Jun. 1972 by W. R. DeBoskey.

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