Integrated circuit on high performance chip

Details Integrated circuit on high performance chip Integrated circuit on high performance chip

2004-06-23

2011-11-01

Zarneke, David (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S456000, C257S618000, C257S531000, C257S532000, C257SE25010, C257SE25014, C257SE25018, C257SE23027

Reexamination Certificate

active

08048766

ABSTRACT:
A method of fabricating a die containing an integrated circuit, including active components and passive components, includes producing a first substrate containing at least one active component of active components and a second substrate containing critical components of the passive components, such as perovskites or MEMS, and bonding the two substrates by a layer transfer. The method provides an improved monolithic integration of devices such as MEMS with transistors.

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