Integrated circuit mounting board having internal termination re

Electricity: electrical systems and devices – Miscellaneous

Patent

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Details

361414, 361424, 338309, H05K 104

Patent

active

042427207

ABSTRACT:
A logic card for interconnection of integrated circuits comprises a laminate for supporting integrated circuit devices. The laminate includes a relatively highly conductive layer. A selected plurality of holes are formed through the laminate in selected patterns at each of a plurality of stations on the laminate. A conductor is disposed in each of the holes. The conductors comprise, in each pattern, first and second groups of conductors. The conductors in each first group have one end effectively exposed on one side of the laminate and the conductors in each second group in each pattern have their opposite ends effectively exposed on opposite sides of the laminate, thus adapting the conductors for connection thereto of either or both of a lead from an integrated circuit and a conductor wire. Coupling means are located internally of the laminate for coupling the conductive layer to the in-hole conductors of the first group in each pattern and defining between the conductive layer and each said conductor a transmission line termination device.

REFERENCES:
patent: 3102213 (1963-08-01), Bedson et al.
patent: 3316618 (1967-04-01), Guarracini
patent: 3488429 (1970-01-01), Boucher
patent: 3876822 (1975-04-01), Davy et al.
patent: 3891898 (1975-06-01), Damon
patent: 3964087 (1976-06-01), Mallon
patent: 4047132 (1977-09-01), Krajewski
Augat Data Sheet, AA1, AA3, AA4, Revised Jan. 1974, Augat Inc.
Technical Bulletin, The Mica Corp.

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