Integrated circuit module with devices interconnected by electro

Details Integrated circuit module with devices interconnected by electro Integrated circuit module with devices interconnected by electro

1991-12-11

1994-08-02

Urban, Edward F.

Telecommunications

Transmitter and receiver at separate stations

Having diverse art device

359152, 359163, 257 82, 257 98, H04B 702, G02F 1015

Patent

active

053353617

ABSTRACT:
An integrated circuit module (501), with enclosed semiconductor devices (107, 115), includes a housing (101) with an electromagnetic wave reflective interior surface (103). A transmitter (105), mounted on a semiconductor device (107), transmits signals derived from a semiconductor device (107). An electromagnetic wave receiver (113), is positioned in the housing (101) such that it receives a transmitted wave via a reflective surface (103) along an electromagnetic wave path (117) from the transmitter (105).

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International Technology Disclosures, "3D Packaging and Vertical Integration of Electronic/Photonic Circuits," author unknown, Apr. 25, 1990.
The MIT Report, "High-Speed Optical Interconnections," Sep. 1991.

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