Integrated circuit module having springy contacts of at least tw

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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439 71, 439331, H01R 909

Patent

active

059677988

ABSTRACT:
An electromechanical module is comprised of an electronic component that is attached to a substrate which is bendable. Multiple springy contacts touch respective I/O pads on the substrate. A compressing mechanism compresses the springy contacts against the I/O pads with forces that bend the substrate. The bending of substrate is reduced by including contacts of a first type, each of which exert a relatively small force against its respective I/O pad; and contacts of a second type, each of which exert a substantially larger force against its respective I/O pad.

REFERENCES:
patent: 3973919 (1976-08-01), Simon
patent: 5273440 (1993-12-01), Ashman et al.
patent: 5870286 (1999-02-01), Butterbaugh et al.
patent: 5877554 (1999-03-01), Murphy

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