Electricity: electrical systems and devices – Miscellaneous
Patent
1983-05-18
1986-01-28
Miska, Vit W.
Electricity: electrical systems and devices
Miscellaneous
361409, 361421, 174 505, 174 52FP, H05K 118, H05K 702, H01J 500
Patent
active
045675457
ABSTRACT:
An integrated circuit module adapted to connect an integrated circuit to an electrical connector. A lead frame (20) with lengthened leads (22), compared to the lead frame of a conventional DIP packaged IC, is laminated to a nonconductive substrate (46). The leads (22) of the lead frame have contact ends (28) laminated in spaced relation along a contact edge (52) of the substrate (46) for contacting the electrical connector. The use of a printed circuit board and the necessity for soldering the IC thereto are thereby eliminated.
The leads (22) may comprise two sets (48,54) with the first set (48) laminated to a first surface (50) of the substrate (46) and the second set (54) wrapped around an edge of the substrate (46) and laminated to the second surface (56). The IC module may include a hermetically sealed IC chip (26) electrically connected to the lead frame (20) with interconnecting wires (22) and substrate (46) may be shaped to allow external electrical components to be mounted on the IC module. The method of making the IC module is also provided.
REFERENCES:
patent: 3404215 (1968-10-01), Burks et al.
patent: 3544857 (1970-12-01), Byrne et al.
patent: 3641401 (1972-02-01), Lynch
patent: 3693252 (1972-09-01), Robertson et al.
patent: 3697666 (1972-10-01), Wakley et al.
patent: 3930115 (1975-12-01), Uden et al.
patent: 3934336 (1976-01-01), Morse
patent: 4079511 (1978-03-01), Grabbe
patent: 4105861 (1978-08-01), Hascoe
patent: 4413309 (1983-11-01), Takahashi et al.
LandOfFree
Integrated circuit module and method of making same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit module and method of making same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit module and method of making same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1309829