Integrated circuit module and method

Details Integrated circuit module and method Integrated circuit module and method

1997-11-05

2000-02-15

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361761, 361764, 361704, 361762, 361771, 361783, 257700, 257795, 257774, 257782, 257783, H05K 702

Patent

active

060259957

ABSTRACT:
An integrated circuit module is provided having a substrate, an integrated circuit on the substrate and defining an active surface remote from the substrate, and a die attached to the active surface of the integrated circuit. A layer of non-conductive material conformally coats the die and active surface of the integrated circuit, with the layer of non-conductive material having a substantially level top surface. A plurality of vias are formed in the layer of non-conductive material aligned with the die and integrated circuit, respectively. A pattern of metallization is disposed on the top surface of the layer of non-conductive material extending through the plurality of vias and selectively interconnecting the die to the integrated circuit.

REFERENCES:
patent: 4996097 (1991-02-01), Fischer
patent: 5019535 (1991-05-01), Wojnarowski et al.
patent: 5151776 (1992-09-01), Wojnarowski et al.
patent: 5157589 (1992-10-01), Cole, Jr. et al.
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5401687 (1995-03-01), Cole et al.
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5527741 (1996-06-01), Cole et al.
patent: 5811879 (1998-09-01), Akram
patent: 5841193 (1998-11-01), Eichelberger
patent: 5866952 (1999-02-01), Wojnarowski et al.

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