Integrated circuit micromodule obtained by the continuous assemb

Details Integrated circuit micromodule obtained by the continuous assemb Integrated circuit micromodule obtained by the continuous assemb

1995-03-30

1996-10-29

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361728, 257678, H01L 2328

Patent

active

055698794

ABSTRACT:
A micromodule includes a slotted metal strip and a perforated dielectric strip having a thickness of less than 70 micrometers, preferably between 30 and 50 micrometers. The metal strip is bonded to the dielectric strip so as to overlie the slots in the metal strip. A chip is bonded to the dielectric strip and connected to the metal strip through the perforations in the dielectric strip. An insulating resin layer encapsulates the chip and is bonded to the dielectric strip. The micromodule may be used, for example, in a smart card, as a radiating antenna, or as an identification label.

REFERENCES:
patent: 4800419 (1989-01-01), Long et al.
patent: 5008734 (1991-04-01), Dutta et al.
patent: 5012386 (1991-04-01), McShane et al.
patent: 5034800 (1991-07-01), Marchisi
patent: 5051275 (1991-09-01), Wong
patent: 5087961 (1992-02-01), Long et al.
patent: 5115298 (1992-05-01), Loh
patent: 5173766 (1992-12-01), Long et al.
patent: 5175397 (1992-12-01), Lindberg
patent: 5261157 (1993-11-01), Chang

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