Integrated circuit micro-module

Details Integrated circuit micro-module Integrated circuit micro-module

2009-02-20

2010-11-30

Mulpuri, Savitri (Department: 2812)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S415000, C257S700000, C257S713000, C257S723000, C257S724000, C257SE21499, C257SE21506, C257SE21536, C257SE21705

Reexamination Certificate

active

07843056

ABSTRACT:
In one aspect, an integrated circuit package composed of a plurality of immediately adjacent stacked layers of cured, planarizing, photo-imageable dielectric is described. At least one interconnect layer is provided between a pair of adjacent dielectric layers. An integrated circuit is positioned within one or more of the dielectric layers such that at least one of the dielectric layers extends over the active surface of the integrated circuit. The integrated circuit is electrically coupled with I/O pads on a surface of the package at least in part through the interconnect layer or electrically conductive vias. In particular embodiments, the package can include thermal pipes, a heat sink, multiple integrated circuits, interconnect layers, conductive vias that electrically connect different components of the package and/or passive devices. In some specific embodiments, the dielectric layers are formed from a suitable epoxy such as SU-8 type. In a method aspect of the invention, the dielectric layers may be formed using a spin-on coating approach and patterned using conventional photolithographic techniques.

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