Integrated circuit metallization with superconductor BEOL wiring

Active solid-state devices (e.g. – transistors – solid-state diode – Superconductive contact or lead

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257 37, 257662, 257663, 257750, 257 33, H01L 3900, H01L 2906, H01L 3922, H01L 2348

Patent

active

060877111

ABSTRACT:
The present invention discloses an integrated circuit that is wired with a high-temperature superconductive material that is superconductive at temperatures of about 70.degree. K and above, and methods of making the integrated circuit. The front-end manufactured semiconductor structure is patterned with a preferred precursor metal or metal oxide and a complementary compound is superposed and reacted to form wiring lines of superconductor ceramics that complete integrated circuits within the front-end manufactured semiconductor structure. The front-end manufactured semiconductor structure is alternatively patterned first with the complementary compound and the precursor metal is thinly patterned by ion implantation. The front-end manufactured semiconductor structure is then treated to form wiring lines of superconductor ceramics that complete integrated circuits within structure. The conductive lines, if formed within an oxidized portion of the complementary compound, are self-insulating by the presence of the oxided complementary compound. Operation of the devices is accomplished at "high" superconductive temperatures that cause improved solid state operation of the device, minimizing molecular vibrations and dislocation effects, and cause the wiring to be superconductive.

REFERENCES:
patent: 4837609 (1989-06-01), Gurvitch et al.
patent: 4965248 (1990-10-01), Poppe et al.
patent: 5010053 (1991-04-01), Maroni
patent: 5079223 (1992-01-01), Maroni
patent: 5141917 (1992-08-01), Tanaka et al.
patent: 5183800 (1993-02-01), Nakagawa
patent: 5196379 (1993-03-01), Weaver et al.
patent: 5200389 (1993-04-01), Tachikawa et al.
patent: 5206213 (1993-04-01), Cuomo et al.
patent: 5274268 (1993-12-01), Yamazaki
patent: 5311036 (1994-05-01), Nishino et al.
patent: 5471069 (1995-11-01), Nakamura et al.
patent: 5550389 (1996-08-01), Nishino et al.
patent: 5710462 (1998-01-01), Mizushima et al.
patent: 5897367 (1999-04-01), Kerber et al.
Nastasi, et al., Appl. Phys. Lett. 52(20) May 1988, p. 1729-1731.
Hubbard, et al., J. Appl. Phys. 69(4) Feb. 1991, p. 2397-2404.
Severin, et al., Mat. Res. Bull., vol. 23, pp. 707-717,1998.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit metallization with superconductor BEOL wiring does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit metallization with superconductor BEOL wiring, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit metallization with superconductor BEOL wiring will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-544685

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.