Integrated circuit lead frame positioner apparatus and method

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

72427, 72428, 140105, H01R 4300, B21D 4500

Patent

active

051559013

ABSTRACT:
An apparatus and method for precisely positioning an integrated circuit lead frame is disclosed. This apparatus includes a positioning post that cooperates with an index hole in the lead frame, and a lower spring finger. The index hole of the lead frame is placed over the positioning post, and the opposite or bottom side of the lead frame rests on the lower spring finger. An upper spring finger is then brought down on top of the lead frame, aligning with the lower spring finger. As the two spring fingers press against the lead frame, the deflection of the two spring fingers cause the lead frame to move slightly and causes the positioning post located in the index hole to function as a mechanical stop of the deflection movement of the lead frame thereby achieving a very accurate positioning of the lead frame.

REFERENCES:
patent: 4627159 (1986-12-01), Waldner

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