Patent
1988-11-18
1990-04-10
Hille, Rolf
357 74, H01L 2348
Patent
active
049165062
ABSTRACT:
The lead-frame in an integrated circuit package, a dual-inline-package (DIP), has a plurality of leads of which four are extensions of a down-set die-attach pad. A dog-leg finger lines in the plane of the leads and is an extension of a peripheral portion of the die-attach pad. The dog-leg finger has first and second parts that are at right angles to each other so as to lock a distal port of it in the body of encapsulating resin. An integrated circuit die having at least one power transistor is grounded electrically via a terminal and wire bonded to the distal part of the dog-leg finger. This ground circuit parallels and is redundant to a ground circuit through the die via the conductive resin that attaches the bottom of the die to the die-attach pad, the later circuit having a relatively high electrical resistance. The four leads that are extensions of the die-attach pad serve both to remove heat from the die and to provide an electrical ground connection. The extending finger of dog-leg shape provides a point of ground-wire attachment that does not move relative to the encapsulating resin as do other peripheral parts of the die attach pad during temperature cycling.
REFERENCES:
patent: 3611061 (1971-10-01), Segerson
patent: 3930114 (1975-12-01), Hodge
Hille Rolf
Loke Steven
Sprague Electric Company
LandOfFree
Integrated-circuit lead-frame package with low-resistance ground does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated-circuit lead-frame package with low-resistance ground, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated-circuit lead-frame package with low-resistance ground will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2302392