Metal fusion bonding – Process – Plural joints
Patent
1978-11-06
1980-11-11
Husar, Francis S.
Metal fusion bonding
Process
Plural joints
29827, 174 52FP, 228 6A, 357 70, B23K 3102, H01L 2160
Patent
active
042328152
ABSTRACT:
A device and method for coupling leads to integrated circuit packages via lead frame rail members. The lead frame rail members consist of resilient leads coupled to a first rail and other resilient leads coupled to a second rail. The first rail is connected to the second rail such that the leads of the first rail are separated from and oppose the leads of the second rail. The coupling device consists of a main frame, a spreading means, an insertion means, and a releasing means. The spreading means is coupled to the main frame and is adapted to spread the leads of each rail of a lead frame rail member away from the opposing leads of the other rail such that an integrated circuit package can be inserted between the opposing leads at intervals along the rail member. The insertion means is coupled to the main frame and is adapted to insert coupling material between the integrated circuit packages and the leads. The releasing means is also coupled to the main frame and is adapted to release the resilient leads of each rail member such that the coupling material is clamped between the leads and the package. Also included in the invention is a method for coupling leads to a plurality of integrated circuit packages.
REFERENCES:
patent: 3524249 (1970-08-01), Toshio
patent: 3617819 (1971-11-01), Boisvert
patent: 3823863 (1974-07-01), Piechocki
patent: 4012835 (1977-03-01), Wallick
patent: 4054238 (1977-10-01), Lloyd
Miyauchi Nobuaki
Nakano Masahiko
Crosby Gene P.
Husar Francis S.
Kyocera International, Inc.
LandOfFree
Integrated circuit lead coupling device and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit lead coupling device and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit lead coupling device and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1687359