Integrated circuit lead assembly structure with first and second

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor

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357 68, 357 71, 357 80, 361404, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

050634321

ABSTRACT:
An integrated circuit lead assembly structure is disclosed which comprises one or more pc boards, having a first lead pattern adjacent one surface of a pc board and a second lead pattern adjacent another surface of a pc board with at least a portion of the leads of the first lead pattern running perpendicular to corresponding leads of the second lead pattern to reduce crosstalk and coupling between the leads. An array of bonding pads is provided on one surface of the structure together with a die mounting area and electrical connection is made from the bonding pads to leads not on the same surface through vias or plated-through holes which respectively pass through the structure from the bonding pad to the appropriate lead. When a laminate of several pc boards is used, power and/or ground electrodes may be provided on other surfaces and also electrically connected to one or more bonding pads. Means for electrically compensating for the uneven length of the leads are also disclosed as well as decoupling capacitors mounted on the assembly and electrically connected between the power and ground electrodes.

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