Integrated circuit interposer with power and ground planes

Details Integrated circuit interposer with power and ground planes Integrated circuit interposer with power and ground planes

1997-12-10

1999-11-09

Fahmy, Wael

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257691, 257664, 257692, H01L 2348, H01L 2312

Patent

active

059820276

ABSTRACT:
An integrated circuit device has power and ground planes supplied through an interposer secured to the die side. The interposer may consist of a sandwich of metal sheets providing conductive planes for power supply and ground. The planes may be separated by a dielectric which may be designed to provide the necessary decoupling capacitance for the die. The lower of the conductive planes may be of larger surface area and may be adhesively secured to the die, for example, by adhesive tape. The smaller area plane may be secured to the larger area plane through the dielectric layer. With this configuration, each of the conductive planes may be independently wire bonded to the die.

REFERENCES:
patent: 4801999 (1989-01-01), Hayward et al.
patent: 5068708 (1991-11-01), Newman
patent: 5089878 (1992-02-01), Lee
patent: 5214845 (1993-06-01), King et al.
patent: 5220195 (1993-06-01), McShane et al.
patent: 5227232 (1993-07-01), Lim

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