Integrated circuit interconnect leads releasably mounted on film

Details Integrated circuit interconnect leads releasably mounted on film Integrated circuit interconnect leads releasably mounted on film

1990-12-31

1995-08-01

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174258, 174259, 174260, 361813, H05K 100

Patent

active

054381657

ABSTRACT:
A method and film/interconnect lead combination for attaching a plurality of sets of interconnect leads on a strip of film using an adhesive which loses bonding strength upon being exposed to energy such as heat or ultra violet light. The film holds the interconnect leads firmly in their proper position for bonding to an integrated circuit chip and to a leadframe or substrate such as a printed wiring board or a ceramic substrate for hybrid circuits. Either during or after bonding the interconnect leads to the leadframe or substrate, energy is applied to the adhesive holding the interconnect leads to the film and the film is detached from the interconnect leads in a manner which will not damage the leads due to the reduced adhesive strength. Thus, the leadframe package will not enclose the film.

REFERENCES:
patent: 3718535 (1973-02-01), Armstrong et al.
patent: 4250398 (1981-02-01), Ellis et al.
patent: 4640981 (1987-02-01), Dery et al.
patent: 4642421 (1987-02-01), Dery et al.
patent: 4691225 (1987-09-01), Murakami et al.
patent: 4701363 (1987-10-01), Barber
patent: 4761335 (1988-08-01), Aurichio et al.
patent: 4774634 (1988-09-01), Tate et al.

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