Integrated circuit interconnect design

Details Integrated circuit interconnect design Integrated circuit interconnect design

1990-06-18

1991-05-14

Larkins, William D.

357 68, H01L 23495, H01L 23535

Patent

active

050160826

ABSTRACT:
A plurality of discrete bonding sites on an integrated circuit chip are electrically interconnected using a unique electrical interconnection lead. The interconnection lead comprises an electrically conductive strip having a first end and a second end. The strip is integrally connected at its first end to an electrically conductive tape comprising a plurality of conductive strips. The interconnection lead further comprises a plurality of bonding regions provided between the first and second ends of the conductive strip. These bonding regions provide the sites wherein the conductive strip is electrically connected to the appropriate bond site on the chip. The interconnection lead is suitable for use with tape automated bonding and flexible circuitry techniques.

REFERENCES:
patent: 3798509 (1974-03-01), Vladik
patent: 4010488 (1977-03-01), Gruszka et al.
patent: 4034149 (1977-07-01), Zaleckas
patent: 4188636 (1980-02-01), Sato et al.
patent: 4413404 (1983-11-01), Burns
patent: 4558345 (1985-12-01), Dwyer et al.
Dowdle, D. M., "Flex Takes on Boarders", Circuits Manufacturing, Dec. '87, pp. 79-86.

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