Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2008-03-11
2008-03-11
Trinh, Michael (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S531000, C257S728000, C257S784000, C438S106000, C438S381000
Reexamination Certificate
active
10610497
ABSTRACT:
The invention relates to the field of electronics, more particularly to the wire bonds incorporated into an integrated circuit package such as a quad flat pack, a ball grid array or hybrid style module. The present invention takes the normally undesirable wire bond inductance and uses it in an operational circuit where positive inductance is required. The circuit in which the wire bond inductance is used is located primarily in the integrated circuit die housed in the integrated circuit package, but may also include off-die components. In one example, a wire bond is used as the required series inductance in a discrete circuit impedance inverter which consists of two shunt-to-ground negative inductances and one series positive inductance. One of the negative inductances is located on-die, while the other is located off-die.
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PCT/CA02/01847 International Search Report, Feb. 4, 2004, 3 pages.
PCT/CA02/01847 International Preliminary Examination Report, Apr. 13, 2004, 5 pages.
Grundlingh Johan M.
Wight James Stuart
Trinh Michael
Zarbana Digital Fund LLC
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