Integrated circuit including memory element doped with...

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S004000, C257S257000, C257S268000, C257SE21647, C257SE21669, C257SE23145, C257SE23149, C257SE45002

Reexamination Certificate

active

08003971

ABSTRACT:
An integrated circuit includes a first electrode, a second electrode, and a damascene structured memory element coupled to the first electrode and the second electrode. The memory element has a height and a width. The height is greater than or equal to the width. The memory element includes resistance changing material doped with dielectric material.

REFERENCES:
patent: 6653193 (2003-11-01), Gilton
patent: 6869841 (2005-03-01), Xu
patent: 6873541 (2005-03-01), Lung et al.
patent: 6881623 (2005-04-01), Campbell et al.
patent: 7061013 (2006-06-01), Hideki
patent: 7115927 (2006-10-01), Hideki et al.
patent: 7211819 (2007-05-01), Karpov
patent: 7319235 (2008-01-01), Happ
patent: 7384825 (2008-06-01), Park et al.
patent: 7402851 (2008-07-01), Hideki et al.
patent: 7473597 (2009-01-01), Lee et al.
patent: 7534625 (2009-05-01), Karpov et al.
patent: 7615439 (2009-11-01), Schricker et al.
patent: 7622307 (2009-11-01), Park et al.
patent: 7678642 (2010-03-01), Chang
patent: 7696503 (2010-04-01), Lung et al.
patent: 7749898 (2010-07-01), Besser et al.
patent: 2005/0029502 (2005-02-01), Hudgens
patent: 2005/0041467 (2005-02-01), Chen
patent: 2007/0010082 (2007-01-01), Pinnow et al.
patent: 2007/0138458 (2007-06-01), Lung
patent: 2007/0241319 (2007-10-01), Chang
patent: 2007/0267620 (2007-11-01), Happ
patent: 2007/0267721 (2007-11-01), Kuh et al.
patent: 2008/0185574 (2008-08-01), Campbell et al.
patent: 2009/0114898 (2009-05-01), Ricker
patent: 2009/0137080 (2009-05-01), Chang et al.
“Application of a DC Glow Discharge Source with Controlled Plasma Potential in Plasma Immersion Ion Implantation”, M. Ueda, et al., American Institute of Physics, 1999, (4 pgs.).
“Plasma Immersion Ion Implantation Using Plasmas Generated by Radio Frequency Techniques”, J. Tendys, et al., American Institute of Physics, 1988, (3 pgs.).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit including memory element doped with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit including memory element doped with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit including memory element doped with... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2631011

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.