Integrated circuit including gas phase deposited packaging...

Details Integrated circuit including gas phase deposited packaging... Integrated circuit including gas phase deposited packaging...

2011-07-19

2011-07-19

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Portion of housing of specific materials

C257S669000, C257S678000, C257S701000, C257S788000, C257SE23191

Reexamination Certificate

active

07982309

ABSTRACT:
An integrated circuit includes a substrate including an active area and a gas phase deposited packaging material encapsulating the active area.

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Zweben, Carl, “Advances in Materials for Optoelectronic, Microelectronic and Moems/Mems Packaging.” Mar. 14, 2002, 18thIEEE Semi-Therm Symposium, pp. 30-34.

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