Integrated circuit including external electronic components...

Details Integrated circuit including external electronic components... Integrated circuit including external electronic components...

2007-12-04

2007-12-04

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S784000, C361S792000

Reexamination Certificate

active

10457630

ABSTRACT:
An integrated circuit package can include electronic components used to enhance the performance of the integrated circuit that is part of the package. In order to reduce some adverse effects of including the electronic components, void regions are introduced into portions of the integrated circuit package interconnect layers.

REFERENCES:
patent: 6437599 (2002-08-01), Groen
patent: 6700076 (2004-03-01), Sun et al.
patent: 6722031 (2004-04-01), Japp et al.
Maxim Integrated Products, “Introduction to LVDS, PECL, and CML,” Sep. 2000, pp. 1-14.
PMC-Sierra, “Designing Multi-Gigabit Serial Backplanes with High Speed SERDES Solutions,” Sep. 2000, pp. 1-16.
Kal Mustafa and Chris Sterzik, Texas Instruments,“AC-Coupling Between Differential LVPECL, LVDS, HSTL, and CML,” Mar. 2003, pp. 1-20.

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