Integrated circuit IC package and a process for cooling an integ

Details Integrated circuit IC package and a process for cooling an integ Integrated circuit IC package and a process for cooling an integ

1996-06-12

1998-11-03

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257713, 361704, 438 15, H05K 720

Patent

active

058318259

ABSTRACT:
The heat dissipated by the integrated circuit (11) is evacuated into a plate (13) having an extended surface in order to transmit the heat into the integrated circuit package (10) and into the wiring board (12) by means of the input-output terminals (17) of the package.

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IBM Technical Disclosure Bulletin, vol. 13, No. 1, Jun. 1970, NY, p. 58, G.O. Tiffany, "Integrated Circuit Package and Heat Sink".
1993 Japan IEMT Symposium, Jun. 1994, Kanazawa, JP, pp. 41-45, B. Freyman et al., "Ball Grid Array (bga): the New Standard for High I/o Surface Mount Packages".
4th IEEE/CHMT European Int. Electr. Manuf. Technol. Symp., Jun. 1988, Neuilly Sur Seine, FR, pp. 34-36; C.M. Val et al., "Mounting Open-Via Chip-Carriers (for 100 to 300 inputs/outputs i.c.)".

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