Integrated circuit (IC) carrier assembly incorporating...

Details Integrated circuit (IC) carrier assembly incorporating... Integrated circuit (IC) carrier assembly incorporating...

2008-07-22

2008-07-22

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S723000

Reexamination Certificate

active

11736540

ABSTRACT:
An integrated circuit (IC) carrier assembly includes a printed circuit board (PCB). A carrier is soldered to the PCB. The carrier includes a grid of electrical contact islands surrounding a receiving zone for receiving an IC. Pairs of adjacent islands are interconnected by respective resilient suspension means. Each resilient suspension means includes a serpentine member. The IC received in the receiving zone is electrically coupled to some of the plurality of islands adjacent to the receiving zone.

REFERENCES:
patent: 5760469 (1998-06-01), Higashiguchi et al.
patent: 6050832 (2000-04-01), Lee et al.
patent: 6078505 (2000-06-01), Turudic
patent: 6214645 (2001-04-01), Kim
patent: 6246015 (2001-06-01), Kim
patent: 6946743 (2005-09-01), Silverbrook
patent: 7221043 (2007-05-01), Silverbrook
patent: 19540814 (1997-05-01), None
patent: 0852397 (1998-07-01), None
patent: 1049162 (2000-12-01), None
patent: 2745930 (1997-09-01), None
patent: 2349014 (2000-10-01), None
patent: 2000-012732 (2000-01-01), None
patent: 2001-036222 (2001-02-01), None
patent: 2001-094228 (2001-04-01), None
patent: WO 92/06495 (1992-04-01), None

Affiliated with

Also associated with

Rating

Integrated circuit (IC) carrier assembly incorporating... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit (IC) carrier assembly incorporating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit (IC) carrier assembly incorporating... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3947022