Integrated circuit heating system and method therefor

Details Integrated circuit heating system and method therefor Integrated circuit heating system and method therefor

2005-04-12

2005-04-12

Pert, Evan (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB

Reexamination Certificate

active

06879172

ABSTRACT:
Semiconductor die analysis is enhanced via a method and system that use a heater having a plurality of heating elements to heat a selected portion of the die. According to an example embodiment of the present invention, the heater is thermally coupled to the die, and the die is operated while at least one of the plurality of heating elements heats a portion of the die. A response is detected and used to analyze the die. The present invention makes possible selective heating of the die in a manner that is readily controllable and implemented. Die analysis, including, for example, critical timing path analysis, is enhanced by this ability to controllably heat the die.

REFERENCES:
patent: 6037793 (2000-03-01), Miyazawa et al.
patent: 6111421 (2000-08-01), Takahashi et al.
patent: 6163161 (2000-12-01), Neeb
patent: 6235543 (2001-05-01), Kiyama
patent: 6265888 (2001-07-01), Hsu

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