Integrated circuit heat sink with rotatable heat pipe

Details Integrated circuit heat sink with rotatable heat pipe Integrated circuit heat sink with rotatable heat pipe

1997-04-23

1998-10-27

Sough, Hyung S.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

257719, 361700, F28D 1500

Patent

active

058266453

ABSTRACT:
An apparatus is a heat conducting connection between a heat pipe and a structure such as an integrated circuit heat sink. The heat sink contains a groove with extension tabs protruding above edges of the groove so that the tabs can be bent over to hold the heat pipe in the groove which is dimensioned to give a clearance space around the heat pipe. When the tabs are bent down far enough to deform the heat pipe or a heat conductive hardening material is used to fill the clearance space, the heat pipe is fixed in place. If the tabs are bent down to barely contact the heat pipe and a heat conductive non-hardening material is used to fill the clearance space, the heat pipe can still be rotated within the groove.

REFERENCES:
patent: 4588023 (1986-05-01), Munekawa
patent: 5095404 (1992-03-01), Chao
patent: 5402160 (1995-03-01), Kadowaki et al.
patent: 5464054 (1995-11-01), Hinshaw et al.
patent: 5513070 (1996-04-01), Xie et al.
patent: 5549155 (1996-08-01), Meyer et al.
patent: 5646822 (1997-07-01), Bhatia et al.

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