Integrated circuit heat seat

Details Integrated circuit heat seat Integrated circuit heat seat

1996-07-24

1998-06-09

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361687, 361689, 361700, 361704, 361717, 361718, 174 152, 174 163, 165 804, 257713, 257714, 257715, 622592, H05K 720

Patent

active

057644829

ABSTRACT:
The apparatus is a heat sink for an integrated circuit chip which uses heat pipe cooling to remove the heat. The heat sink is a heat conductive structure such as a bowl which is associated with the integrated circuit socket, with the heat conductive structure held against the integrated circuit. A heat pipe is attached to the structure by using an extension from the heat conductive structure and wrapping the extension around a simple cylindrical heat pipe. One embodiment uses spring clips to attach the heat sink to the socket, and another version uses attachment screws through tabs which are formed from the material around a bowl shaped heat conductive structure.

REFERENCES:
patent: 4345267 (1982-08-01), Corman et al.
patent: 4658331 (1987-04-01), Berg
patent: 5095404 (1992-03-01), Chao
patent: 5295043 (1994-03-01), Beijer
patent: 5329426 (1994-07-01), Villani
patent: 5339214 (1994-08-01), Nelson
patent: 5375652 (1994-12-01), Matsunaga et al.
patent: 5422790 (1995-06-01), Chen
patent: 5483098 (1996-01-01), Joiner, Jr.
patent: 5486981 (1996-01-01), Blomquist
patent: 5504652 (1996-04-01), Foster et al.
patent: 5588483 (1996-12-01), Ishida
patent: 5598320 (1997-01-01), Toedtman

Affiliated with

Also associated with

Rating

Integrated circuit heat seat does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit heat seat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit heat seat will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2208439