Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
2006-04-18
2006-04-18
Duong, Tho (Department: 3753)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S104210, C165S104330, C165S080300
Reexamination Certificate
active
07028760
ABSTRACT:
A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.
REFERENCES:
patent: 3209062 (1965-09-01), Scholz
patent: 3490718 (1970-01-01), Vary
patent: 3519067 (1970-07-01), Schmidt
patent: 3543841 (1970-12-01), Eastman
patent: 3680189 (1972-08-01), Noren
patent: 3821018 (1974-06-01), Grant
patent: 3827480 (1974-08-01), Gammel et al.
patent: 3834457 (1974-09-01), Madsen
patent: 3840069 (1974-10-01), Fischer et al.
patent: 4046190 (1977-09-01), Marcus et al.
patent: 4047198 (1977-09-01), Sekhon et al.
patent: 4101691 (1978-07-01), Borchert
patent: 4118756 (1978-10-01), Nelson et al.
patent: 4145708 (1979-03-01), Ferro et al.
patent: 4461343 (1984-07-01), Token et al.
patent: 5000256 (1991-03-01), Tousignant
patent: 5052472 (1991-10-01), Takahashi et al.
patent: 5305184 (1994-04-01), Andresen et al.
patent: 5305185 (1994-04-01), Samarov et al.
patent: 5323292 (1994-06-01), Brzezinski
patent: 5386143 (1995-01-01), Fitch
patent: 5390077 (1995-02-01), Paterson
patent: 5427174 (1995-06-01), Lomolino, Sr. et al.
patent: 5465782 (1995-11-01), Sun et al.
patent: 5513070 (1996-04-01), Xie et al.
patent: 5642776 (1997-07-01), Meyer, IV et al.
patent: 5694295 (1997-12-01), Mochizuki et al.
patent: 5754401 (1998-05-01), Saneinejad et al.
patent: 5757621 (1998-05-01), Patel
patent: 5784256 (1998-07-01), Nakamura et al.
patent: 5880524 (1999-03-01), Xie
patent: 6082443 (2000-07-01), Yamamoto et al.
patent: 6212074 (2001-04-01), Gonsalves et al.
patent: 6256201 (2001-07-01), Ikeda et al.
patent: 6263959 (2001-07-01), Ikeda et al.
patent: 6269866 (2001-08-01), Yamamoto et al.
patent: 6302192 (2001-10-01), Dussinger et al.
patent: 6317322 (2001-11-01), Ueki et al.
patent: 6356448 (2002-03-01), DiBene, II et al.
patent: 6535386 (2003-03-01), Sathe et al.
patent: 6650544 (2003-11-01), Lai
patent: 6896039 (2005-05-01), Dussinger et al.
patent: 1 284 506 (1968-12-01), None
patent: 2 579 371 (1986-09-01), None
patent: 1 402 509 (1975-08-01), None
patent: 54-154277 (1979-05-01), None
patent: 59024538 (1984-02-01), None
patent: 407160 (1974-04-01), None
patent: 589531 (1978-02-01), None
patent: 987357 (1983-01-01), None
patent: 1261029 (1986-09-01), None
patent: 1476297 (1989-04-01), None
IBM Technical Disclosure Bulletin;Conduction Cooled Heat Plate For Modular Circuit Package; Dombrowskas and Patch; vol. 13, No. 2, pp. 442, Jul. 1970.
IBM Technical Disclosure Bulletin;Low-Cost Cooling Package, Nuccio; vol. 18, No. 11, pp. 3761 & 3762, Apr. 1976.
Dussinger Peter M.
Minnerly Kenneth L.
Myers Thomas L.
Rosenfeld John H.
Duane Morris LLP
Duong Tho
Thermal Corp.
LandOfFree
Integrated circuit heat pipe heat spreader with through... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit heat pipe heat spreader with through..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit heat pipe heat spreader with through... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3618409