Integrated circuit heat pipe heat spreader with through...

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S104210, C165S083000, C165S185000, C165S076000, C361S700000, C257S715000

Reexamination Certificate

active

07100680

ABSTRACT:
The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.

REFERENCES:
patent: 3209062 (1965-09-01), Schotz
patent: 3490718 (1970-01-01), Vary
patent: 3519067 (1970-07-01), Schmidt
patent: 3543841 (1970-12-01), Eastman
patent: 3680189 (1972-08-01), Noren
patent: 3827480 (1974-08-01), Gammel et al.
patent: 3834457 (1974-09-01), Madsen
patent: 4046190 (1977-09-01), Marcus et al.
patent: 4047198 (1977-09-01), Sekhon et al.
patent: 4118756 (1978-10-01), Nelson et al.
patent: 4145708 (1979-03-01), Ferro et al.
patent: 4461343 (1984-07-01), Token et al.
patent: 5000256 (1991-03-01), Tousignant
patent: 5052472 (1991-10-01), Takahashi et al.
patent: 5305184 (1994-04-01), Andresen et al.
patent: 5305185 (1994-04-01), Samarov et al.
patent: 5323292 (1994-06-01), Brzezinski
patent: 5386143 (1995-01-01), Fitch
patent: 5390077 (1995-02-01), Paterson
patent: 5427174 (1995-06-01), Lomolino, Sr. et al.
patent: 5465782 (1995-11-01), Sun et al.
patent: 5513070 (1996-04-01), Xie et al.
patent: 5642776 (1997-07-01), Meyer, IV et al.
patent: 5694295 (1997-12-01), Mochizuki et al.
patent: 5754401 (1998-05-01), Saneinejad et al.
patent: 5757621 (1998-05-01), Patel
patent: 5784256 (1998-07-01), Nakamura et al.
patent: 5880524 (1999-03-01), Xie
patent: 6082443 (2000-07-01), Yamamoto et al.
patent: 6212074 (2001-04-01), Gonsalves et al.
patent: 6256201 (2001-07-01), Ikeda et al.
patent: 6263959 (2001-07-01), Ikeda et al.
patent: 6269866 (2001-08-01), Yamamoto et al.
patent: 6302192 (2001-10-01), Dussinger et al.
patent: 6317322 (2001-11-01), Ueki et al.
patent: 6356448 (2002-03-01), DiBene, II et al.
patent: 6535386 (2003-03-01), Sathe et al.
patent: 6650544 (2003-11-01), Lai
patent: 1 284 506 (1968-12-01), None
patent: 2 579 371 (1986-09-01), None
patent: 1 402 509 (1975-08-01), None
patent: 52034673 (1977-03-01), None
patent: 54-154277 (1979-05-01), None
patent: 62-078729 (1987-04-01), None
patent: 2-087344 (1990-03-01), None
patent: 6-301976 (1994-10-01), None
patent: 7-073508 (1995-03-01), None
patent: 9-017033 (1997-01-01), None
patent: 407160 (1974-04-01), None
patent: 589531 (1978-02-01), None
patent: 987357 (1983-01-01), None
patent: 126102 9 (1986-09-01), None
patent: 1261029 (1986-09-01), None
patent: 1476297 (1989-04-01), None
IBM Technical Disclosure Bulletin;Conduction Cooled Heat Plate For Modular Circuit Package; Dombrowskas and Patch; vol. 13, No. 2, pp. 442, Jul. 1970.
IBM Technical Disclosure Bulletin;Low-Cost Cooling Package, Nuccio; vol. 18, No. 11, pp. 3761 & 3762, Apr. 1976.
Low-Cost Cooling Package Article, by C. Nuccio, IBM Technical Disclosure Bulletin, vol. 18, No. 11, Apr. 1976, pp. 3761-3762.
Conduction Cooled Heat Plate For Modular Circuit Package Article, R.J. Dombrowskas and P.O Patch, IBM Technical Disclosure Bulletin, vol. 13, No. 2, Jul. 1970, p. 442.
Fujikura Ltd, Drawing of Lobster Heat Pipe, Part. No. FHP-47201, Sep. 25, 1995.
Fujikura Ltd, Report No. FHP-95-185, Lobster Heat Pipe For Cooling Alpha, Oct. 25, 1995, pp. 1-3.
Fujikura America, Inc., Heat Pipe Quotation, Oct. 31, 1995.
Engineering Drawing No. FHP-0430-01 for Heat Sink Assembly by Sun Microsystems dated Apr. 30, 2001.
Facsimile Cover Sheet from Sun Microsystems regarding drawing CH090W-971119 (980204) dated Feb. 4, 1998.
Engineering Drawing No. CH090W-971119 dated Feb. 4, 1998 (see 980204 on drawing).
Engineering Drawing dated Feb. 26, 1998.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit heat pipe heat spreader with through... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit heat pipe heat spreader with through..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit heat pipe heat spreader with through... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3576807

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.