Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
2005-05-24
2005-05-24
Duong, Tho V (Department: 3743)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S104210, C165S076000, C361S700000, C257S715000
Reexamination Certificate
active
06896039
ABSTRACT:
A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.
REFERENCES:
patent: 3209062 (1965-09-01), Scholz
patent: 3490718 (1970-01-01), Vary
patent: 3519067 (1970-07-01), Schmidt
patent: 3537514 (1970-11-01), Levedahl
patent: 3543841 (1970-12-01), Eastman
patent: 3613778 (1971-10-01), Feldman, Jr.
patent: 3675711 (1972-07-01), Bilinski et al.
patent: 3680189 (1972-08-01), Noren
patent: 3681843 (1972-08-01), Arcella et al.
patent: 3762011 (1973-10-01), Staudhammer et al.
patent: 3788388 (1974-01-01), Barkmann
patent: 3821018 (1974-06-01), Grant
patent: 3827480 (1974-08-01), Gammel et al.
patent: 3834457 (1974-09-01), Madsen
patent: 4042316 (1977-08-01), Rabe
patent: 4046190 (1977-09-01), Marcus et al.
patent: 4047198 (1977-09-01), Sekhon et al.
patent: 4101691 (1978-07-01), Borchert
patent: 4118756 (1978-10-01), Nelson et al.
patent: 4145708 (1979-03-01), Ferro et al.
patent: 4177646 (1979-12-01), Guadagnin et al.
patent: 4231423 (1980-11-01), Haslett
patent: 4274479 (1981-06-01), Eastman
patent: 4279479 (1981-07-01), Schrier
patent: 4327752 (1982-05-01), Hickel
patent: 4354482 (1982-10-01), Beisecker
patent: 4361133 (1982-11-01), Bonnema
patent: 4365851 (1982-12-01), Andres et al.
patent: 4366526 (1982-12-01), Lijoi et al.
patent: 4374528 (1983-02-01), Tittert
patent: 4382448 (1983-05-01), Tittert
patent: 4461343 (1984-07-01), Token et al.
patent: 4489777 (1984-12-01), Del Bagno et al.
patent: 4503483 (1985-03-01), Basiulis
patent: 4557413 (1985-12-01), Lewis et al.
patent: 4616699 (1986-10-01), Grote
patent: 4641404 (1987-02-01), Seydel et al.
patent: 4697205 (1987-09-01), Eastman
patent: 4748314 (1988-05-01), Desage
patent: 4765396 (1988-08-01), Seidenberg
patent: 4777561 (1988-10-01), Murphy et al.
patent: 4807697 (1989-02-01), Gernert et al.
patent: 4819719 (1989-04-01), Grote et al.
patent: 4830097 (1989-05-01), Tanzer
patent: 4840224 (1989-06-01), Dietzsch
patent: 4865729 (1989-09-01), Saxena et al.
patent: 4880052 (1989-11-01), Meyer, IV et al.
patent: 4883116 (1989-11-01), Seidenberg et al.
patent: 4885129 (1989-12-01), Leonard et al.
patent: 4912548 (1990-03-01), Shanker et al.
patent: 4921041 (1990-05-01), Akachi
patent: 4929414 (1990-05-01), Leonard et al.
patent: 4931905 (1990-06-01), Cirrito et al.
patent: 4960202 (1990-10-01), Rice et al.
patent: 5000256 (1991-03-01), Tousignant
patent: 5052472 (1991-10-01), Takahashi et al.
patent: 5059496 (1991-10-01), Sindorf
patent: 5076351 (1991-12-01), Munekawa et al.
patent: 5076352 (1991-12-01), Rosenfeld et al.
patent: 5101560 (1992-04-01), Leonard et al.
patent: 5103897 (1992-04-01), Cullimore et al.
patent: 5148440 (1992-09-01), Duncan
patent: 5160252 (1992-11-01), Edwards
patent: 5200248 (1993-04-01), Thompson et al.
patent: 5219020 (1993-06-01), Akachi
patent: 5242644 (1993-09-01), Thompson et al.
patent: 5253702 (1993-10-01), Davidson et al.
patent: 5268812 (1993-12-01), Conte
patent: 5283715 (1994-02-01), Carlsten et al.
patent: 5305184 (1994-04-01), Andresen et al.
patent: 5305185 (1994-04-01), Samarov et al.
patent: 5320866 (1994-06-01), Leonard
patent: 5323292 (1994-06-01), Brzezinski
patent: 5331510 (1994-07-01), Ouchi et al.
patent: 5333470 (1994-08-01), Dinh
patent: 5386143 (1995-01-01), Fitch
patent: 5390077 (1995-02-01), Paterson
patent: 5408128 (1995-04-01), Furnival
patent: 5409055 (1995-04-01), Tanaka et al.
patent: 5427174 (1995-06-01), Lomolino, Sr. et al.
patent: 5465782 (1995-11-01), Sun et al.
patent: 5513070 (1996-04-01), Xie et al.
patent: 5522455 (1996-06-01), Brown et al.
patent: 5549394 (1996-08-01), Nowak et al.
patent: 5642776 (1997-07-01), Meyer, IV et al.
patent: 5664890 (1997-09-01), Nowak et al.
patent: 5694295 (1997-12-01), Mochizuki et al.
patent: 5711816 (1998-01-01), Kirlin et al.
patent: 5754401 (1998-05-01), Saneinejad et al.
patent: 5757621 (1998-05-01), Patel
patent: 5769154 (1998-06-01), Adkins et al.
patent: 5784256 (1998-07-01), Nakamura et al.
patent: 5826645 (1998-10-01), Meyer, IV et al.
patent: 5847925 (1998-12-01), Progl et al.
patent: 5880524 (1999-03-01), Xie
patent: 5883426 (1999-03-01), Tokuno et al.
patent: 5947193 (1999-09-01), Adkins et al.
patent: 5950710 (1999-09-01), Liu
patent: 6041211 (2000-03-01), Hobson et al.
patent: 6055157 (2000-04-01), Bartilson
patent: 6056044 (2000-05-01), Benson et al.
patent: 6082443 (2000-07-01), Yamamoto et al.
patent: 6148906 (2000-11-01), Li et al.
patent: 6154364 (2000-11-01), Girrens et al.
patent: 6158502 (2000-12-01), Thomas
patent: 6167948 (2001-01-01), Thomas
patent: 6169852 (2001-01-01), Liao et al.
patent: 6212074 (2001-04-01), Gonsalves et al.
patent: 6230407 (2001-05-01), Akutsu
patent: 6239350 (2001-05-01), Sievers et al.
patent: 6256201 (2001-07-01), Ikeda et al.
patent: 6263959 (2001-07-01), Ikeda et al.
patent: 6269866 (2001-08-01), Yamamoto et al.
patent: 6293333 (2001-09-01), Ponnappan et al.
patent: 6302192 (2001-10-01), Dussinger et al.
patent: 6303081 (2001-10-01), Mink et al.
patent: 6317322 (2001-11-01), Ueki et al.
patent: 6356448 (2002-03-01), DiBene, II et al.
patent: 6382309 (2002-05-01), Kroliczek et al.
patent: 6388882 (2002-05-01), Hoover et al.
patent: 6397935 (2002-06-01), Yamamoto et al.
patent: 6418017 (2002-07-01), Patel et al.
patent: 6535386 (2003-03-01), Sathe et al.
patent: 6650544 (2003-11-01), Lai
patent: 1 284 506 (1968-12-01), None
patent: 2 579 371 (1986-09-01), None
patent: 1 402 509 (1975-08-01), None
patent: 54-154277 (1979-05-01), None
patent: 59024538 (1984-02-01), None
patent: 407160 (1974-04-01), None
patent: 589531 (1978-02-01), None
patent: 987357 (1983-01-01), None
patent: 1261029 (1986-09-01), None
patent: 1476297 (1989-04-01), None
IBM Technical Disclosure Bulletin;Conduction Cooled Heat Plate For Modular Circuit Package;Dombrowskas and Patch; vol. 13, No. 2, pp442, Jul. 1970.
IBM Technical Disclosure Bulletin;Low-Cost Cooling Package,Nuccio; vol. 18, No. 11, pp 3761 & 3762, Apr. 1976.
Rosenfeld, J.H., “Nucleate Boiling Heat Transfer in Porous Wick Structures,” ASME HTD Vol. 108,Heat Transfer Fundamentals, Design, Applications, and Operating Problems,R.H. Shah, Ed., pp. 47-55, 1989.
Rosenfeld, J.H. and J.E. Lindemuth, “Acetone Heat Pipes for Stirling Orbiter Refrigerator/Freezer,” Contract G350240J70—final report to GE Gov't. Service, Apr. 16, 1993.
McDonald, K.E., Berchowitz, D., Rosenfeld, J.H., and Lindemuth, J.E., “Stirling Refrigerator for Space Shuttle Experiments,” Proc. 29thIECEC, paper 94-4179, pp. 1807-1812, 1994.
Lindemuth, J.E., “Stainless Steel/Propylene Heat Pipe Interface for Stirling Orbiter Refrigerator/Freezer,” NASA LeRC final report, PO. No. C-76546-F, Apr. 21, 1998.
Rosenfeld, J.H. and Lindemuth, J.E., “Heat Transfer in Sintered Groove Heat Pipes,” International Heat Pipe Conference, 1999.
Rosenfeld, J.H. and North, M.T., “Porous Media Heat Exchangers for Cooling of High-Power Optical Components,”Optical Engineering,vol. 34, No. 2, pp. 335-341, Feb. 1995.
Rosenfeld, J.H., Toth, J.E., and Phillips, A.L., “Emerging Applications for Porous Media Heat Exchangers,” Int. Conf. on Porous Media and Their Applications in Science, Eng., and Industry, Kona, HI, Jun. 16-21, 1996.
Dussinger Peter M.
Minnerly Kenneth L.
Myers Thomas L.
Rosenfeld John H.
Duane Morris LLP
Duong Tho V
Thermal Corp.
LandOfFree
Integrated circuit heat pipe heat spreader with through... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit heat pipe heat spreader with through..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit heat pipe heat spreader with through... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3423008