Integrated circuit heat dissipation system

Details Integrated circuit heat dissipation system Integrated circuit heat dissipation system

2006-07-18

2006-07-18

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23098, C257S713000, C257S721000, C257S722000, C257S716000, C257S719000, C257S675000, C361S704000, C361S699000, C361S690000, C361S698000, C361S717000, C165S080400, C174S015100, C174S016300

Reexamination Certificate

active

07078803

ABSTRACT:
An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation efficiency. The integrated circuit heat dissipation system includes a lid attached to a substrate, a cap attached about the lid creating a heat dissipation chamber, and a semiconductor chip attached to the lid by a thermally conductive adhesive. The lid may or may not form a cavity about the semiconductor chip depending upon the substrate utilized. The lid preferably includes a plurality of fins extending from thereof defining a plurality of channels or a plurality of grooves thereby increasing the heat flux of the lid.

REFERENCES:
patent: 5220804 (1993-06-01), Tilton et al.
patent: 5268814 (1993-12-01), Yakubowski
patent: 5285351 (1994-02-01), Ikeda
patent: 5291064 (1994-03-01), Kurokawa
patent: 5345107 (1994-09-01), Daikoku et al.
patent: 5528456 (1996-06-01), Takahashi
patent: 5687577 (1997-11-01), Ballard et al.
patent: 5705850 (1998-01-01), Ashiwake et al.
patent: 5731542 (1998-03-01), Limper-Brenner et al.
patent: 5768103 (1998-06-01), Kobrinetz et al.
patent: 5846852 (1998-12-01), Limper-Brenner et al.
patent: 5859763 (1999-01-01), Nam et al.
patent: 5880524 (1999-03-01), Xie
patent: 5990418 (1999-11-01), Bivona et al.
patent: 6317326 (2001-11-01), Vogel et al.
patent: 6377453 (2002-04-01), Belady
patent: 2001/0040006 (2001-11-01), Pompeo et al.
patent: 2002/0113142 (2002-08-01), Patel et al.
Spray Cooling, Tilton, Donald E., PhD Dissertation, University of Kentucky, 1989.
Spray Cooling for the 3-D Cube Computer, Tilton, Donald E. et al., InterSociety Conference on Thermal Phenomena pp. 169-176, 1994.
Liquid Nitrogen Spray Cooling of a Simulated Electronic Chip, Tilton, Donald E. et al., Proceedings of the 1993 Cryogenic Engineering Conference, Albuquerque, New Mexico, 1993.
Advanced System Packaging for Embedded High Performance Computing, Sienski, Ken, et al.

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