Integrated circuit having superconductive wirings

Superconductor technology: apparatus – material – process – High temperature – per se – Having tc greater than or equal to 150 k

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 68, 505703, 505704, 505856, 505887, 505 1, H01L 2348, H01L 2946, H01B 1200, H04B 100

Patent

active

050831887

ABSTRACT:
An integrated circuit having a superconductive wiring comprises a semiconductor substrate, an integrated circuit device formed on the semiconductor substrate and a wiring connected to the integrated circuit device. The wiring is formed of a superconductive material and has a wide portion for heat radiation. The manufacturing method of the same comprises the steps of preparing a semiconductor substrate, forming an integrated circuit device on the semiconductor substrate, and connecting a wiring having a wide portion for heat radiation and formed of a superconductive material to the integrated circuit device on the semiconductor substrate.

REFERENCES:
patent: 4660061 (1987-04-01), Sweeny et al.
patent: 4748494 (1988-05-01), Yamada et al.
patent: 4805420 (1989-02-01), Porter et al.
patent: 4837609 (1989-06-01), Gurvitch et al.
patent: 4843445 (1989-06-01), Stemme
patent: 4949157 (1990-08-01), Minami
"Superconductivity Above 90K in the Compound YBa.sub.2 Cu.sub.3 O.sub.x :Structural, Transport, and Magnetic Properties".
Grant et al., Physical Review B, vol. 35, #13, 1 May 1987, pp. 7242-7244.
"A New High-Temperature Superconductor: Bi.sub.2 Sr.sub.3--x Ca.sub.x Cu.sub.2 O.sub.8+y "Subramanian et al., Science, vol. 239, 26 Feb. 1988, pp. 1015-1017.
"Bi--Sr--Ca--Cu--O Superconductor System With Critical Temperatures of 80 and 107 K", Kugimiya et al., App. Phys. Lett. vol. 52, #22, 30 May 1988, pp. 1895-1896.
Klein et al., "Ion Beam Disposition of in Situ Superconducting Y--Ba--Cu--O Films," Appl. Phys. Lett. 56 (4), Jan. 22, 1990, pp. 394-396.
S. Chromik, "High T.sub.o Y--Ba--Cu--O Thin Films Prepared by in Situ Low-Temperature Codeposition of Y, BaF.sub.2, and Cu on .alpha.--Al.sub.2 O.sub.3 substrates, "Appl. Phys. Lett. 56 (22), May 28, 1990, pp. 2237-2239.
Mogro-Campero et al., "Lower Temperature Post-Annealing of Thin Films of YBa.sub.2 Cu.sub.3 O.sub.7 at Lower Oxygen Partial Pressure," Appl. Phys. Lett. 58 (4), Jan. 28, 1991, pp. 417-418.
Nakamura et al., Applied Physics Society Extended Abstract of 1990 Spring National Meeting (Lecture Number 28p-V-1).
Aoki, The Theory of Applied Physics, Chapter 7, Section 1 (Published by Asakura Shoten, .COPYRGT. 1969).
Ekin, Panson and Blankenship, "Method for Making Low-Resistivity Contacts to High T.sub.c Superconductors," Appl. Phys. Lett. 52 (4), Jan. 25, 1988, pp. 331-333.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit having superconductive wirings does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit having superconductive wirings, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit having superconductive wirings will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-119109

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.