Integrated circuit having spare parts activated by a high-to-low

Details Integrated circuit having spare parts activated by a high-to-low Integrated circuit having spare parts activated by a high-to-low

1980-12-08

1983-08-16

Miller, Stanley D.

Electrical transmission or interconnection systems

Nonlinear reactor systems

Parametrons

307304, 357 51, 357 59, 365 96, 365200, 371 8, H01L 2704, H01L 2904, H03H 512, H03L 300

Patent

active

043993729

ABSTRACT:
Disclosed is a semiconductor integrated circuit device comprising a semiconductor chip including a plurality of elements constituting multi-functional circuits and a control signal generating circuit incorporated within the semiconductor chip. The control signal generating circuit includes a variable resistance element which irreversibly changes its resistivity when a voltage having a magnitude larger than a specific level, is applied. The variable resistance element is connected in series with a fixed resistor which is further connected in parallel to the output electrodes of a field effect transistor. A control signal is applied to the input terminal of the transistor when the resistance of the variable resistance element is intended to change. An output terminal connected to the connection of the serial connected elements indicates logical "1" or "0" depending on whether the variable resistance element is in the high resistivity state or low resistivity state. In the semiconductor integrated circuit, the output of the control signal generating circuit is transmitted to at least one of the multi-functional circuits, so that it is activated or left deactivated.

REFERENCES:
patent: 3478229 (1969-11-01), Avery
patent: 3758761 (1973-09-01), Henrion
patent: 3792319 (1974-02-01), Tsang
patent: 4064493 (1977-12-01), Davis
patent: 4139786 (1979-02-01), Raymond, Jr. et al.
patent: 4146902 (1979-03-01), Tanimoto et al.
patent: 4210996 (1980-07-01), Amemiya et al.
Integrated Electronics: Analog and Digital Circuits and Systems, Millman et al., 1972, McGraw-Hill, N.Y., pp. 221-225 and 559-565.
"Fusible Link Device", Ewald et al., IBM Tech. Disc. Bull., vol. 19, No. 8, 1-1977, pp. 3089-3090.

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