Integrated circuit having resistive memory cells

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device

Reexamination Certificate

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Details

C257S296000, C257S192000, C257S200000, C257SE21267, C257SE21645, C257SE21665

Reexamination Certificate

active

07601995

ABSTRACT:
A memory includes an array of memory cells, each memory cell including resistive material, a first insulation material laterally surrounding the resistive material of each memory cell, and a heat spreader between the memory cells to thermally isolate each memory cell.

REFERENCES:
patent: 5844208 (1998-12-01), Tustaniwskyj et al.
patent: 6605527 (2003-08-01), Dennison et al.
patent: 6815704 (2004-11-01), Chen
patent: 6908812 (2005-06-01), Lowrey
patent: 6961277 (2005-11-01), Moore et al.
patent: 7079972 (2006-07-01), Wood et al.
patent: 2003/0218197 (2003-11-01), Jang et al.
patent: 2004/0041218 (2004-03-01), Sharma et al.
patent: 2005/0045915 (2005-03-01), Lee
patent: 2005/0236656 (2005-10-01), Tran et al.
patent: 10236439 (2002-08-01), None
patent: 1484799 (2004-12-01), None
S.L. Cho et al., “Highly scalable on-axis confined cell structure for high density PRAM beyond 256Mb”, 2005 Symposium on VLSI Technology Digest of Technical Papers, pp. 96-97.
Stefan Lai et al., “OUM—A 180 nm Nonvolatile Memory Cell Element Technology For Stand Alone and Embedded Applications”, IEDM, 2001.
Stefan Lai, “Current status of the phase change memory and its future”, IEDM, 2003.
H. Horii et al., “A novel cell technology using N-doped GeSbTe films for phase-change RAM”, VLSI, 2003.
Y.N. Hwang et al., “Full integration and reliability evaluation of phase-change RAM based on 0.24 μm-CMOS technologies”, 2003 Symposium on VLSI Technology Digest of Technical Papers.
C.W. Jeong et al., “Switching current scaling and reliability evaluation in PRAM”, NVSMW, 2004.
F. Pellizzer et al., “Novel μTrench phase-change memory cell for embedded and stand-alone non-volatile memory applications”, VLSI, 2004.
A. Pirovano et al., “Scaling analysis of phase-change memory technology”, VLSI, 2004.

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