Integrated circuit having passive circuit elements

Details Integrated circuit having passive circuit elements Integrated circuit having passive circuit elements

1993-09-03

1995-05-16

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

257535, H01L 2702

Patent

active

054163560

ABSTRACT:
An integrated circuit is formed from a first layer of conductive material (30) which is separated from a second layer of conductive material (39) by a layer of dielectric material (36). The first layer of conductive material (30) is patterned to form a first plate (32, 59) of a capacitor (22, 50, 62, 72). An electrical interconnect (33, 63) is formed within the first plate (32, 59), respectively. A via (37) is formed in the layer of dielectric material (36). A second layer of conductive material (39) is patterned to form a second plate (42, 56, 66, 76) of the capacitor (22, 50, 62, 72) and a planar spiral inductor (21, 51, 61, 71). The planar spiral inductor (21, 51, 61, 71) is surrounded by the second plate (42, 56, 66, 76) of the capacitor (22, 50, 62, 72).

REFERENCES:
patent: 3138744 (1964-06-01), Kilby
patent: 3675091 (1972-07-01), Naomoto et al.
patent: 4801883 (1989-01-01), Muller et al.
patent: 4839712 (1989-06-01), Mamodaly et al.
patent: 4969032 (1990-11-01), Scheitlin et al.
patent: 5177381 (1993-01-01), Friesen et al.
patent: 5223735 (1993-06-01), Kinoshita et al.
patent: 5283462 (1994-02-01), Stengel
"Programmable Substrate Inductor," IBM Technical Disclosure Bulletin, vol. 32, No. 6B, Nov. 1989, pp. 310-317.

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