Integrated circuit having metal substrate used to provide electr

Electrical transmission or interconnection systems – Personnel safety or limit control features – Interlock

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Details

3073031, 361413, 361395, H03K 326, H03R 2368

Patent

active

050702580

ABSTRACT:
An integrated circuit disclosed in this application includes a circuit board in which a conductive layer having a desired pattern is formed on a metal substrate through an insulating layer, and a circuit element group mounted on the insulating layer and connected to the predetermined conductive layer. A judgment circuit for discriminating on the basis of a potential of the metal substrate which one of at least two different logic processing modes is set is formed on the insulating layer. The circuit element group includes a circuit element including a logic processing unit having at least two different logic processing contents. The circuit element selectively switches and executes a logic processing operation corresponding to the logic processing mode discriminated by the judgment circuit from the at least two different logic processing contents.

REFERENCES:
patent: 3946428 (1976-03-01), Anazawa et al.
patent: 4507697 (1985-03-01), Ozil et al.
patent: 4755902 (1988-07-01), Takahashi
patent: 4918335 (1990-04-01), Chall, Jr.
patent: 5016086 (1991-05-01), Inoue et al.

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