Integrated circuit having metal substrate

Details Integrated circuit having metal substrate Integrated circuit having metal substrate

1993-04-16

1993-12-28

Trans, Vincent N.

Boots, shoes, and leggings

364489, 361684, 361764, H05K 116

Patent

active

052745708

ABSTRACT:
An integrated circuit of this application includes a circuit board in which a conductive layer of a desired pattern is formed on a metal substrate through an insulating layer, a circuit element mounted on the insulating layer, and first and second connectors for connecting at least the circuit element and an external device. The circuit element is nondetachably mounted on the insulating layer, and has a nonvolatile content which can be rewritten by an external operation. The first connector connects at least the circuit element to a portion to be controlled, and the second connector connects the circuit element and an external processing device via a path different from that of the first connector so as to process a storage content of the circuit element.

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European Search Report citing 4 prior art references (attached), completed on Jan. 29, 1990 by Examiner F. M. A. Toussaint in The Hague.
English Abstract of Japanese Patent Publication No. 46-13234-one page.
Huse, Horst: Multi-Mikrocomputer-System modular aufgebaut, Multi-Prozessor-Systeme, pub. by Franzis Verlag 1982, p. 60.
German Patent Office Action dated May 4, 1993 (with English translation).

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