Integrated circuit having conductors of enhanced cross-sectional

Details Integrated circuit having conductors of enhanced cross-sectional Integrated circuit having conductors of enhanced cross-sectional

1996-11-14

1998-12-08

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257752, 257758, 257760, 257763, 257774, H01L 2348, H01L 2352, H01L 2940

Patent

active

058474625

ABSTRACT:
An interconnect structure is provided having a conductor with enhanced thickness. The conductor includes an upper portion and a lower portion, wherein the lower portion geometry is sufficient to increase the current-carrying capacity beyond that provided by the upper portion. The lower portion is formed by filling a trench within an upper dielectric region, and the upper portion is formed by selectively removing a conductive material from the upper dielectric surface except for regions directly above the lower portion. The upper and lower portions thereby form a conductor of enhanced cross-section which can be produced by modifying a via-etch mask, rather than having to reconfigure and/or move interconnect features formed by a metal mask.

REFERENCES:
patent: 5034799 (1991-07-01), Tomita et al.
patent: 5189506 (1993-02-01), Cronin et al.
patent: 5451804 (1995-09-01), Lur et al.
patent: 5596230 (1997-01-01), Hong

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