Integrated circuit having an insulated memory

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material

Reexamination Certificate

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Details

C257S004000, C257SE21003

Reexamination Certificate

active

07615770

ABSTRACT:
A memory cell includes a first electrode, a second electrode, and phase-change material between the first electrode and the second electrode. The phase-change material defines a narrow region. The memory cell includes first insulation material having a first thermal conductivity and contacting the phase-change material. A maximum thickness of the first insulation material contacts the narrow region. The memory cell includes a second insulation material having a second thermal conductivity greater than the first thermal conductivity and contacting the first insulation material.

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H. Horii et al., “A Novel Cell Technology Using N-doped GeSbTe Films for Phase Change RAM”, VLSI, 2003.
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C.W. Jeong, “Switching Current Scaling and Reliability Evaluation in PRAM”, NVSMW 2004.
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M.H.R. Lankhorst, et al., “Low-cost and nanoscale non-volatile memory concept for future silicon chips”, Nature Materials, published online Mar. 13, 2005.

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