Integrated circuit having an improved bond pad

Details Integrated circuit having an improved bond pad Integrated circuit having an improved bond pad

1988-05-23

1990-09-25

Hille, Rolf

357 70, H01L 2348, H01L 2944, H01L 2952

Patent

active

049597060

ABSTRACT:
An improved bond pad on an integrated circuit has an elongated rectangular shape, on which the wire is bonded at a non-central location displaced toward an outer corner, so that there is room on the pad for a second bond site to be used for a rework bond. The pad corner closest to the path of a wire may be chamfered to reduce the distance of closest approach.

REFERENCES:
patent: 3519890 (1970-07-01), Ashby

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