Integrated circuit having a thermally shielded electric...

Details Integrated circuit having a thermally shielded electric... Integrated circuit having a thermally shielded electric...

2005-09-06

2005-09-06

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080200, C257S537000, C257S707000, C257S713000, C257S622000, C257S625000, C257S659000, C361S709000, C361S710000, C361S718000, C361S719000, C361S720000, C361S722000, C361S818000

Reexamination Certificate

active

06940720

ABSTRACT:
An integrated circuit includes an electric resistor trace, a substrate and a thermally conductive structure arranged above or below the electric resistor trace for dissipating heat from the electric resistor trace to the substrate. The present invention is based on the finding that by introducing the additional thermally conductive structure, despite the introduction of this additional thermally conductive structure requiring space at first, due to the significantly increased heat conductivity to the substrate, a smaller overall chip area for implementing integrated resistors can be obtained.

REFERENCES:
patent: 3710193 (1973-01-01), Greenberg et al.
patent: 5367284 (1994-11-01), Morris
patent: 5955781 (1999-09-01), Joshi et al.
patent: 6236103 (2001-05-01), Bernstein et al.
patent: 43 01 552 (1994-07-01), None

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