Integrated circuit having a pre-attached conductive mounting med

Details Integrated circuit having a pre-attached conductive mounting med Integrated circuit having a pre-attached conductive mounting med

1983-07-22

1987-08-18

Sikes, William L.

Metal fusion bonding

Process

Critical work component, temperature, or pressure

228123, 437180, H01L 3902

Patent

active

046880755

ABSTRACT:
A semiconductor wafer having a plurality of integrated circuits is provided. One surface of the wafer includes a plurality of electrical contacts on the circuits which are subsequently attached to leads. The other surface of the wafer is provided with a conductive tape. The wafer is cut, e.g., sawed, resulting in each individual circuit having a pre-attached conductive mounting media. The individual circuits can then be attached to a substrate through the conductive mounting media. Other embodiments are disclosed.

REFERENCES:
patent: 3978578 (1976-09-01), Murphy
patent: 4078711 (1978-03-01), Bell et al.
patent: 4293587 (1981-10-01), Trueblood
patent: 4390598 (1983-06-01), Phy
patent: 4423548 (1984-01-01), Hulseweh
patent: 4451971 (1984-06-01), Milgram
patent: 4451972 (1984-06-01), Batinovich
patent: 4485553 (1984-12-01), Christian et al.

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